ANSYS

Digital prototyping to operations made easy.

Discover the power of Engineering Simulation with ANSYS

Overview:

Engineering simulation is now taking over the entire product lifecycle. Starting from digital exploration to digital prototyping, and from operations till maintenance everywhere you find ANSYS engineering & simulation software being used to enhance the overall product manufacturing experience.

Listed below are some of the ANSYS products that simplify the product simulation:

  • Structures
  • Fluids
  • Electronics
ANSYS’s Technical Capabilities

The table below lists the capabilities of the ANSYS Engineering and Simulation Software: Structures, Fluids, and Electronics. Read the table and know how these capabilities simplify the product lifecycle management.

Products

Capabilities

Features

ANSYS Structures

User Experience

  • Intuitive interface of ANSYS Mechanical

Meshing

  • Optimal meshing on every model
  • Controls to get fine-tune meshing

Advanced Capabilities

  • Material Designer to create representative volume elements (RVEs)
  • NonLinear ADaptivity (NLAD) capability 
  • Unique technology for modelling crack growth

Additive Manufacturing

  • use of ANSYS Additive Print and ANSYS Additive Suite

Structural Analysis

  • Analyse single load cases, vibration or transient analysis
  • Examine linear and nonlinear behaviour of materials, joints and geometry
  • Carry out drop, impact and explosion simulations
  • Offshore simulation

ANSYS Fluids

User Experience

  • Single-Window experience
  • User-selectable themes
  • Parallel processing
  • Speed and simplicity

CFD Solutions

  • Well-Validated CFD results for virtually any fluid or multiphysics application
  • Simplified modelling and meshing

ANSYS Electronics

 

Electromagnetic, Electronics, Thermal and Electromechanical Simulation

  • Simulate electromagnetic performance across component, circuit and system design.
  • Evaluate temperature, vibration and other critical mechanical effects.
  • Achieve first-pass system design success.

Wireless and RF

  • Design, simulate and validate the performance of antennas and RF and microwave components.
  • Integrated microwave circuit and system modelling

PCB and electronic packaging

  • Chip-Package-System (CPS) offers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis
  • Automated thermal analysis and integrated structural analysis
  • chip-aware and system-aware simulation

Electromechanical and power electronics

  • Robust integration of motors, sensors, and actuators
  • Thermal and mechanical analysis

Electronics Thermal Management

  • Robust, automatic meshing
  • Heat transfer and fluid flow simulation

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