Digital prototyping to operations made easy.

Discover the power of Engineering Simulation with ANSYS


Engineering simulation is now taking over the entire product lifecycle. Starting from digital exploration to digital prototyping, and from operations till maintenance everywhere you find ANSYS engineering & simulation software being used to enhance the overall product manufacturing experience.

Listed below are some of the ANSYS products that simplify the product simulation:

  • Structures
  • Fluids
  • Electronics
ANSYS’s Technical Capabilities

The table below lists the capabilities of the ANSYS Engineering and Simulation Software: Structures, Fluids, and Electronics. Read the table and know how these capabilities simplify the product lifecycle management.




ANSYS Structures

User Experience

  • Intuitive interface of ANSYS Mechanical


  • Optimal meshing on every model
  • Controls to get fine-tune meshing

Advanced Capabilities

  • Material Designer to create representative volume elements (RVEs)
  • NonLinear ADaptivity (NLAD) capability 
  • Unique technology for modelling crack growth

Additive Manufacturing

  • use of ANSYS Additive Print and ANSYS Additive Suite

Structural Analysis

  • Analyse single load cases, vibration or transient analysis
  • Examine linear and nonlinear behaviour of materials, joints and geometry
  • Carry out drop, impact and explosion simulations
  • Offshore simulation

ANSYS Fluids

User Experience

  • Single-Window experience
  • User-selectable themes
  • Parallel processing
  • Speed and simplicity

CFD Solutions

  • Well-Validated CFD results for virtually any fluid or multiphysics application
  • Simplified modelling and meshing

ANSYS Electronics


Electromagnetic, Electronics, Thermal and Electromechanical Simulation

  • Simulate electromagnetic performance across component, circuit and system design.
  • Evaluate temperature, vibration and other critical mechanical effects.
  • Achieve first-pass system design success.

Wireless and RF

  • Design, simulate and validate the performance of antennas and RF and microwave components.
  • Integrated microwave circuit and system modelling

PCB and electronic packaging

  • Chip-Package-System (CPS) offers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis
  • Automated thermal analysis and integrated structural analysis
  • chip-aware and system-aware simulation

Electromechanical and power electronics

  • Robust integration of motors, sensors, and actuators
  • Thermal and mechanical analysis

Electronics Thermal Management

  • Robust, automatic meshing
  • Heat transfer and fluid flow simulation

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